KIOXIA and Sandisk Unveil a 3D Flash Memory That Flies

Published on January 07, 2026 | Translated from Spanish
Visualization of a 3D flash memory chip, highlighting its design with 332 layers. The image should represent technological advancement with a modern digital background, incorporating transfer speed graphics and energy optimization, showing the complex architecture of the chip.

Companies KIOXIA and Sandisk have unveiled a revolutionary 3D flash memory technology at ISSCC 2025, which sets new standards in terms of speed, energy efficiency, and bit density. With a NAND interface reaching 4.8 Gb/s, this technology far surpasses previous versions of 3D flash memory.

A Significant Leap in Speed and Energy Efficiency

The new 3D flash memory not only improves transfer speed but also optimizes energy consumption. With a NAND interface speed of 4.8 Gb/s, it achieves a 33% increase compared to the eighth generation. In terms of energy efficiency, power consumption at data input has been reduced by 10%, while at data output it achieves a 34% improvement, balancing performance with a lower energy footprint.

Advanced Technology That Boosts Bit Density

Advances in 3D flash memory architecture allow for a 59% increase in bit density, thanks to its innovative 332-layer architecture. This technological leap optimizes storage space, enabling devices to offer higher capacities without sacrificing size or performance.

Innovation for the Next Generation of AI Applications

The growth of advanced applications like artificial intelligence (AI) has been a crucial factor in the evolution of storage technologies. Axel Stoermann, Vice President and Chief Technology Officer of KIOXIA, highlighted that the demand for storage solutions is driven by AI applications, such as edge inference and transfer learning. This new 3D flash memory technology is designed to meet the growing demands for speed, capacity, and energy efficiency in these systems.

The Forward-Looking Vision of KIOXIA and Sandisk

KIOXIA and Sandisk are not stopping here. Both companies are developing the next generation of 9th generation 3D flash memory, which will benefit from CBA technology (Combination of CMOS and existing memory cells). This innovation will enable products with low power consumption, high performance, and efficiency, further consolidating the leadership of both companies in the storage sector.

"Advanced flash memory solutions are positioning KIOXIA and Sandisk as pioneers in innovation, driving the progress of digital society."

With these advances, KIOXIA and Sandisk continue to be leaders in the storage field, adapting to customer needs and contributing to the advancement of digital technology.