Asus Unveils New Motherboards for AMD at CES
During the CES trade show, Asus has decided to expand its hardware portfolio for the AMD platform. The company has unveiled a refreshed range of motherboards, led by its flagship models and complemented with options for various user profiles, from demanding gamers to content creators. 🚀
The New Benchmarks: ROG Crosshair X870E
The main focus falls on two models from the ROG Crosshair series. The X870E Glacial stands out for its all-white aesthetic and a liquid cooling block that covers an extensive surface area for optimal heat dissipation. On the other hand, the X870E Dark Hero retains the iconic dark design of the family, reinforcing the power delivery system and implementing larger heatsinks. Both use the AMD X870E chipset and are configured to support upcoming generations of the brand's processors.
Key features of the flagship models:- ROG Crosshair X870E Glacial: White design with integrated liquid cooling block for advanced thermal management.
- ROG Crosshair X870E Dark Hero: Dark aesthetic with a robust power delivery system and large heatsinks.
- Common platform: Both based on the AMD X870E chipset, prepared for future AMD CPUs.
Asus's refresh spans from the high-end range to options for building powerful systems in different segments.
An Expanded Offering for Every Need
The launch strategy is not limited to the premium segment. Asus has also presented new additions in other popular series. The ROG Strix Neo line receives a redesign and gaming-oriented features. The ProArt motherboards target creative professionals, prioritizing system stability and comprehensive connectivity. The well-known TUF Gaming series, recognized for building durable hardware, incorporates new models with the X870E and B850 chipsets.
Refreshed series and their purposes:- ROG Strix Neo series: Updated for gamers, with new features and designs.
- ProArt series: Aimed at content creators, focused on stability and connectivity.
- TUF Gaming series: Durable options with X870E and B850 chipsets for powerful systems.
Expectations and Thermal Management
Although the designs promise to handle the thermal design power of the new chips efficiently, a question arises in the community about the real capacity of these heatsinks to support extreme overclocking without compromising their elaborate aesthetic. The balance between performance, temperature, and design will be a point to watch. 🔥